A system for protecting wafers from damage caused by an inaccurately-positioned wafer transfer robot blade during the transfer of wafers typically from a wafer cassette to a processing tool. The wafer protection system includes a conductor foil which is electrically separated from the robot blade through a space or gap and is connected to a relay circuit that is normally closed to facilitate flow of electrical power to the robot blade motor. Upon initial contact of the robot blade with the edge of a wafer, the conductor foil deforms and contacts the blade through the space or gap, completing a circuit between the blade and the relay circuit. The relay circuit opens, thereby terminating further power flow to the robot blade motor and immediately preventing further movement of the robot blade against the wafer.