A process-oriented modulized plant for TFT-LCD fabrication capable of preventing cross contaminations is proposed. A plant includes a plurality of independent fabs and warehouses connected between the fabs. Each independent fab can carry out at least one TFT-LCD processes. The respective process used in the first independent fab produces the first group of contaminants. Another respective processes carried out in the second independent fab are affected by the contaminations from the first group of contaminants and results in deterioration of yield rate of the fabrication. At least one automatic transport-and-storage system for central collection and distribution is located in each warehouse. Each warehouse is connected to the independent fabs via at least one automated material handling system to link up the processes together. Moreover, the processes carried out in these independent fabs differ from the others, generate different contamination sources, and/or are sensitive to the corresponding sources form the others.

 
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> Thermally enhanced flip chip package and method of forming

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