A method of manufacturing a semiconductor device. A cobalt film is formed on a wafer including gate, source, and drain regions. An initial protection metal film is formed with an initial amount of a protection metal film material on the cobalt film. The wafer is thermally treated to form a cobalt silicide film. An additional protection metal film is formed with an additional amount of the protection metal film material.

 
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> Multi-step method for etching strain gate recesses

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