An apparatus and a method for repairing nail pops in a wallboard is disclosed. The apparatus can be placed In a first state in which it acts as a cutting tool and can be used to cut a bore hole into a wallboard to separate a popped nail from the wallboard. The apparatus can also be placed in a second state in which it acts as a driving or impact tool and can be used to drive the popped nail which has been separated from the wallboard, into a framing support. The apparatus may be comprised of first and connecting members and a cutting member. The driving member may have an elongated core and may be connected by the connecting member to the cutting member. The driving member may be able to slide with respect to the connecting member to allow the apparatus to change from the first state to the second state.