A socket and package apparatus are disclosed for increasing the amount of power that can be delivered from an IC board to an IC where the IC package is mounted in a socket connected to the IC board. In one embodiment, the IC package includes a first power plane along with a power carrier and one or more pin receptacles. The power bar carrier includes a first conducting panel that is electrically coupled to the first power plane along a first adjacent edge. The first conducting panel is also electrically coupled to a first plurality of conducting pads.