A multi-axis laser machine in which the working efficiency can be improved even when machining positions in respective systems are different from each other. The positioning operation of a laser positioning unit for positioning an optical path of a laser beam in an axis and the positioning operation of another laser positioning unit for positioning another optical path of the laser beam in another axis are performed independently of each other. An arbitration unit monitors the laser positioning units as to whether they have finished positioning or not. The arbitration unit operates a deflection unit (AOM) so as to supply the laser beam to one of the laser positioning units which has finished positioning. Incidentally, when the laser positioning units finish positioning simultaneously, the arbitration unit supplies the laser beam to the laser positioning units in a predetermined sequence.

 
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> Semiconductor laser and method for manufacturing the same

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