A method of modifying a semiconductor device to provide electrical
parameter monitoring. The device includes a semiconductor die and a
package substrate. The substrate includes a conductive plane. The die is
connected to the plane via a plurality of connection structures. The
method includes disconnecting a first one of the connection structures
from the plane, and connecting the first connection structure to an
external package connection, thereby providing a capability to monitor an
electrical parameter of the die via the external package connection.