An apparatus for measuring alignment of polysilicon shapes to a silicon
area. Each polysilicon shape in a first plurality of polysilicon shapes
has a bridging vertex positioned near the silicon area. Each polysilicon
shape in a second plurality of polysilicon shapes has a bridging vertex
positioned near the silicon area. The second plurality of silicon shapes
is positioned on the opposite side of the silicon area from the first
plurality of silicon shapes. An electrical measurement of how many of the
polysilicon shapes in the first plurality of polysilicon shapes and in
the second plurality of polysilicon shapes provides a measurement of
alignment of the polysilicon shapes and the silicon area.