An integrated circuit (78) includes a memory circuit (10, 110, 210, 310, 410) having a group of bitlines (21 28, 121 128, 221 228, 321 328, 421 428), and having an array of memory cells (11 18) which are each electrically coupled to two bitlines of the group. Each bitline has alternating first (61, 63, 65) and second (62, 64, 66) portions that are respectively located in metalization layers disposed on opposite sides of an insulating layer (84). The first and second portions are electrically coupled by vias (51 54, 334, 437) which extend through the insulating layer. Along the length of each bitline, each first and second portion thereof is disposed in a metalization layer opposite from the metalization layer containing the adjacent portion of each adjacent bitline.

 
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> Chip package structure and process for fabricating the same

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