Electrically, mechanically, and thermally enhanced ball grid array (BGA)
packages are described. An IC die is mounted in a centrally located
cavity of a substantially planar first surface of a stiffener. The first
surface of a substrate is attached to a substantially planar second
surface of the stiffener. The second surface of the stiffener is opposed
to the first surface of the stiffener. A centrally located protruding
portion on the second surface of the stiffener is opposed to the
centrally located cavity. The protruding portion extends through an
opening in the substrate. A wire bond is coupled from a bond pad of the
IC die to a contact pad on the first surface of the substrate through a
through-pattern in the stiffener. The through-pattern in the stiffener is
one of an opening through the stiffener, a recessed portion in an edge of
the stiffener, a notch in an edge of the recessed portion, and a notch in
an edge of the opening.