Disclosed herein is a method of removing an organic material from an electronic device substrate surface. The method is particularly useful when the device substrate includes exposed metal. According to the present method, an electronic device substrate surface is exposed to a solution comprising ozone (O.sub.3) at a concentration ranging from about 45 ppm to about 600 ppm in a solvent consisting of pure propionic acid or propionic acid in combination with deionized water or a carbonate having from 2 to 4 carbons. The method is particularly useful in the manufacture of large surface areas covered with device structures, such as electronic TFT flat panel displays, solar cell arrays, and structures containing light-emitting diodes. The method is also useful for removing organic materials from the surface of solid state device-containing semiconductor substrates.