A solder-free laser module which comprises at least one laser chip clamp-mounting between electrodes. The laser module includes: some electrodes facing each other and having opposite poles; insulating separators placed between the facing surfaces of the electrodes to prevent direct contact between them and their short-circuiting; laser chips mounted between the facing surfaces of said electrodes, making contact with the electrodes, and clamping means for bringing the electrodes facing each other more closely together to ensure their contact with the laser chips positioned between them, thereby ensuring electrical power supply to the aforesaid laser chips and dissipation of the heat generated. The invention further relates to a method for assembling the aforesaid laser module.