A semiconductor device (10) having a gate (16, 18 or 16, 18, 26, 28) with a thin conductive layer (18) is described. As the physical dimensions of semiconductor devices are scaled below the sub-micron regime, very thin gate dielectrics (16) are used. One problem encountered with very thin gate dielectrics is that the carriers can tunnel through the gate dielectric material, thus increasing the undesirable leakage current in the device. By using a thin layer for conductive layer (18), quantum confinement of carriers within conductive layer (18) can be induced. This quantum confinement removes modes which are propagating in the direction normal to the interfacial plane 15 from the Fermi level. Thus, the undesirable leakage current in the device (10) can be reduced. Additional conductive layers (e.g. 28) may be used to provide more carriers.

 
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