A material for forming a silica based film which enables the production of
a silica based film with a reduced etching rate relative to hydrofluoric
acid. This material includes a solid fraction containing a film forming
component capable of generating a silica based film, an organic solvent,
and water, and the water content of the material, as determined by gas
chromatography measurement, is within a range from 0.1 to 50% by weight.