A power element package includes a semiconductor chip, radiating members,
a mold resin member, a lead terminal for control signals, and lead
terminals for large electric current. On a heat accepting surface of the
radiating member, an insulating layer and a conductive layer are
disposed. The lead terminal for control signals is electrically connected
with a gate of the semiconductor chip through the conductive layer. An
emitter of the semiconductor chip is electrically connected through a
solder connection member with a non-insulating portion of the heat
accepting surface.