A multi-package module (MPM) with a heat spreader is disclosed, which comprises a substrate, a chip, a plurality of chip scale packages (CSP), and a heat spreader. The CSPs are disposed on the peripheral region of the substrate, and the chip is disposed on the central region of the substrate among the CSPs. Each CSP has a surface higher than the back surface of the chip to support the heat spreader. The heat spreader has an attachment surface including an extrusion region at the center and a planar region at the periphery. The planar region of the heat spreader is attached to the surfaces of the CSPs, and the extrusion region is thermally coupled to the back surface of the chip to save consumption of thermal interface material (TIM) and a dummy die.