The invention provides a bonding pad structure. At least one lower circuit
layer is disposed overlying the substrate, wherein the lower circuit
layer is a layout of circuit under pad. A top circuit layer is disposed
overlying the lower circuit layer, wherein the top circuit layer
comprises a top interconnect dielectric layer and a top interconnect
pattern in the top interconnect dielectric layer. A top connecting layer
is disposed overlying the top circuit layer, electrically connecting the
top interconnect pattern. A top pad layer is disposed overlying the top
connecting layer. A bonding ball is disposed overlying the top pad layer,
wherein sides of the top interconnect pattern do not overlap a region
extending inwardly and outwardly from a boundary of the bonding ball
within distance of about 2.5.mu.m.