To refine an electrical or electronic component having at least one
discrete or integrated device formed from a wafer, in plate or disk form,
of semiconductive or insulating material, the front face of which device
has at least one protruding electrode and is encapsulated by at least one
front-face encapsulant, the side faces of which device are at least
partly encapsulated by at least one side-face encapsulant, and the rear
face of which device is encapsulated by at least one rear-face
encapsulant, and to refine a method of producing the same, in such a way
that, with the aim of widening the possible uses and applications,
electrical contact is made not solely with the front face of the device
that is to be housed in the plastics package of very small dimensions, it
is proposed that both the side-face encapsulant and the rear-face
encapsulant be formed at least partly of layers, but with the layers
connected, of electrically conductive material.