The present invention provides for a BGA solder ball interconnection to an
outer conductive layer of a laminated circuit assembly having an
underlying circuit layer. The invention includes a raised BGA solder ball
pad substantially co-planar with the outer conductive layer, the raised
pad having a raised face and a plurality of vertical conductive walls and
a BGA solder ball having an average diameter of greater than the width of
the raised face, the BGA solder ball being adhered to the raised face and
to a substantial portion of the vertical conductive walls.