A solid-state imaging device comprises a semi-conductor substrate demarcating a two-dimensional surface, a multiplicity of photoelectric conversion units formed at grid points of a first grid of a first tetragonal matrix and a second tetragonal matrix having grid points between grid points of the first tetragonal matrix, a vertical transfer channel arranged in a vertical direction by weaving a space between the horizontally adjacent photoelectric conversion units, a plurality of single-layered electrodes formed above the vertical transfer channel and arranged in a horizontal direction by weaving a space between the vertically adjacent photoelectric conversion units, and a signal processor having a gate electrode and formed, in correspondence to the vertical transfer channel, at one end of the vertical transfer channel on the semiconductor substrate. A low power consuming solid-state imaging device can be provided.

 
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> Method for driving an imaging device and image pickup device, wherein signals corresponding to same color outputs are combined

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