Methods and compositions for modifying a substrate surface are provided. In accordance with the subject methods, a substrate surface is contacted with a particulate-containing fluid. The fluid is then ultrasonically or sonically agitated to modify the substrate surface. In certain embodiments, the particulate-containing fluid has a pH above the isoelectric point of the substrate. Also provided are devices capable of providing ultrasonic and/or sonic energy and which include a non-acidic, particulate-containing fluid. The subject invention also provides systems and kits for use in practicing the subject methods.