An electronic component includes at least two vertical semiconductor power devices and an electrically conductive contact clip. Each vertical semiconductor device has a first side with at least one first lead electrode and a second side opposing the first side with at least one second load electrode. The contact clip comprises a flat web portion and at least one peripheral rim portion extending from an edge region of the flat web portion. Each of the at least two vertical semiconductor power devices is attached, and electrically connected to, the lower surface of the flat web portion of the contact clip.