A heat dissipating structure of an interface card is applied in an electronic device. The structure includes a heat dissipating apparatus attached to a circuit board of the electronic device, wherein the heat dissipating apparatus comprises a heat sink and a fan received in a room of the heat sink; and an interface card electrically connected to the circuit board of the electronic device via a connector. At least a surface of the interface card that is mounted with semiconductor components is mounted on top of a part of the heat dissipating apparatus in a faced-down manner to dissipate heat generated during operations of the semiconductor components to an external environment through the heat sink and the fan.