A process for the selective removal of a TiO.sub.2-containing substance from an article for cleaning applications is disclosed herein. In one embodiment, there is provided a process for removing a TiO.sub.2-containing substance from an article comprising: providing the article having the TiO.sub.2-containing substance deposited thereupon; reacting the substance with a reactive gas comprising at least one selected from a fluorine-containing cleaning agent, a chlorine-containing cleaning agent and mixtures thereof to form a volatile product; and removing the volatile product from the article to thereby remove the substance from the article.

 
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> Method and apparatus for processing a wafer

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