The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one pivot point. Each of the pivoting arms enable the corresponding polishing head direct access to two polishing stations. The polishing system of the present invention provides flexibility and improves throughput.

 
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> Sensor with at least one micromechanical structure, and method for producing it

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