A method comprising adjusting a first relative position between a substrate and a fabrication unit by a first shift value, forming a first pattern relative to a first pattern instance on the substrate subsequent to adjusting the first relative position by the first shift value, and calculating a second shift value using a first displacement between the first pattern and the first pattern instance and a second displacement between a second relative position of the first pattern instance with respect to a second pattern instance is provided.

 
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> Method and apparatus for prediction of polishing condition, and computer product

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