A semiconductor device should have a structure that allows locating electronic components in a region under a bonding pad. The semiconductor device includes a bonding pad constituting the external connection terminal; a region under the bonding pad including at least two copper layers and a connection via plug, under said bonding pad, disposed so as to connect copper layers that form a pair out of the at least two copper layers; a seal ring constituted of an annular conductor, disposed so as to surround the region under the bonding pad, and to connect a lower one of the copper layers that form said pair to copper layer to form a pair with the lower copper layer; and an interconnect connected to the bonding pad outside the seal ring.