A flip-chip package for implementing a fine solder ball, and a flip-chip
packaging method using the same. The flip-chip package includes a first
wafer having a first electrode and a first under bump metal (UBM) formed
on the first electrode and electrically connected to the first electrode;
and second wafer opposing the first wafer and having a second electrode
located in a position corresponding to the first electrode, and a second
UBM formed on the second electrode and electrically connected to the
second electrode. The first wafer has a depression formed on one or more
areas adjacent to the first UBM, which depression partly receives a
solder ball that connects the first and the second UBMs upon flip-chip
bonding of the first and second wafers. Since the UBM is formed as an
embossing pattern, a fine solder ball can be implemented. Additionally,
the reliability of the package can be improved.