A microelectronic package includes a microelectronic element having contacts, a dielectric element, at least a portion of the dielectric element extending beneath the microelectronic element, and a structure including portions of a lead frame. The structure includes a plurality of terminals and leads formed integrally with the terminals, at least some of the terminals and at least some of the leads being disposed entirely beneath the microelectronic element, and at least some of the contacts being connected to at least some of the terminals by at least some of the leads. The leads and terminals are at least about 50 microns thick.