According to one embodiment, a heat radiating apparatus comprises a shielding case having holding panels thereof arranged at locations substantially opposite to a circuit component to extend from a flat panel of the shielding case, which extends substantially parallel to a circuit board, towards the circuit board so as to cover the surface of the circuit board on which a circuit component is mounted. The head radiating apparatus further comprises a heat sink attached to the holding panels of the shielding case for coming into direct contact with the heat conductive sheet on the circuit component when the circuit board is covered with the shielding case.