A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90% by weight of spherical filler.

 
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< Semiconductor device having an anti-oxidizing layer that inhibits corrosion of an interconnect layer

> Organic electroluminescent device with a ceramic output coupler and method of making the same
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