A multichip module includes at least one first semiconductor chip and at
least one second semiconductor chip. The semiconductor chips are arranged
in coplanar fashion on or in a support medium and respectively include
matching components and contact areas arranged on their active top sides.
At least one second semiconductor chip includes an arrangement of contact
areas which is mirror-inverted in relation to a first semiconductor chip.
At least one first semiconductor chip and at least one second
semiconductor chip are arranged next to and/or behind one another (i.e.,
adjacent to one another) such that those of their edges which
respectively have a matching arrangement of contact areas are opposite
one another. Wiring arrangements extend between respectively opposite
contact areas and between contact areas at the outer edges of the
semiconductor chips and external contacts.