A package for an electronic device equipped with an external terminal other than a terminal for mounting, includes a first internal terminal electrically connected to an external terminal other than the terminal for mounting and a second internal terminal connected to an external terminal for mounting for ground connection which is selectively connected to the internal terminal.

 
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< Encapsulated lead having step configuration

> Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components
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