A package for a flip-chip integrated circuit device and a packaged flip-chip integrated circuit device that include ground strips and power strips disposed on the top surface of the package substrate. Decoupling capacitors are disposed over and electrically coupled to a ground strip and are disposed over and electrically coupled to a power strip. Microvias electrically couple the power strips to a power plane and electrically couple the ground strip to a ground plane. Each power strip and ground strip extend within a die attach region of the package substrate such that a semiconductor die can be bonded thereto for coupling power and ground between the semiconductor die and the decoupling capacitors. The power strip and ground strip provide low impedance pathways between the flip-chip semiconductor die and the decoupling capacitors. Thereby, effective decoupling capacitance is provided that is suitable for high frequency applications.