An integrated electro-optic module may contain a continuous layer of electro-optic polymer through both a splitter portion and a modulator portion in order to facilitate high speed data transmission. The integrated electro-optic module may be fabricated by depositing a bottom cladding layer on a wafer, creating side cladding features, depositing the electro-optic polymer, and coating with a top cladding layer. The electro-optic polymer in both the splitter portion and modulator portion of the integrated electro-optic module may create inverted-ridge waveguide structures. The waveguide in the splitter portion may have a first ridge depth, and the waveguide in the modulator portion may have a second ridge depth, the first ridge depth greater than the second ridge depth.