A system and process for stamping parts having tolerances below 1000 nanometers. The inventive system and process is particularly suited for producing optoelectronic parts. The system includes a stamping press and one or a progression of stamping stations for supporting a punch and die. The stamping stations are designed to maintain substantial alignment of the punch and die with minimal moving components. The stamping station includes a shaft for rigidly guiding the punch to the die. The stamping press is capable of providing the punch with the necessary force to perform the stamping operations. The system includes an interface system for interfacing the force of the press with the punch, while simultaneously structurally decoupling the press from the punch. The system also includes a locating sub-plate, for locating the stamping station in alignment relative to each other, and means for in-line machine stock material before entry into the stamping stations.