A method of manufacturing a telephony earpiece is provided. The method includes providing a speaker diaphragm and constraining the speaker diaphragm using a cap to provide a thin cavity between the cap and the diaphragm. The first resonance peak of the diaphragm/cavity system is damped by a first slow leak in the cap. The frequency response is built up using a rear resonator in the cap and the high frequency end response is enhanced using a front resonator on an opposite side of said diaphragm as said cap. Positioning of these resonator holes is an important factor. The earpiece is tuned using a second leak to adjust amplitude of low frequency end response.