The present invention is directed to a semiconductor apparatus that enables in situ wet processing of semiconductor wafers, and prevents creation of a static pressure within the in situ wet processing system. The apparatus comprises multiple exhaust receptacles. Each exhaust receptacle is operable in an open and closed position and receives an associated toxic wet processing byproduct only in the open position. An exhaust is connected to each exhaust receptacle and suctions the contents of said exhaust receptacle in both the open and closed positions. An intake is connected to said exhaust receptacle only when the exhaust receptacle is in a closed position. The intake introduces a gas chemically compatible to the toxic wet processing byproduct associated with the exhaust receptacle. The exhaust releases the toxic wet processing byproduct and the chemically compatible gas to the same waste stream at the semiconductor factory.