A semiconductor package assembly comprises a first conductive pad on a
semiconductor substrate; a second conductive pad on a package substrate;
a bump physically coupled between the first conductive pad and the second
conductive pad, wherein the bump is substantially lead-free or
high-lead-containing; the bump has a first interface with the first
conductive pad, the first interface having a first linear dimension; the
bump has a second interface with the second conductive pad, the second
interface having a second linear dimension; and wherein the ratio of the
first linear dimension and the second linear dimension is between about
0.7 and about 1.7.