A semiconductor device including a semiconductor element, an electrode pad formed on the semiconductor element, and a bump electrode conductively connected to the electrode pad which includes a resin bump formed on an active face of the semiconductor element and a conductive layer provided from the electrode pad to the surface of the resin bump, the conductive layer and the resin bump being arranged without adhesion.

 
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> Structure of sweep-type fingerprint sensing chip capable of resisting electrostatic discharge (ESD) and method of fabricating the same
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