Fluidic self-assembly may be utilized to form a stack of two integrated
circuits. The integrated circuits may include surface mount electrical
connections and surface features that control the alignment between the
integrated circuits. In particular, the contacts may be provided on one
side of each integrated circuit and surface features may cause the
integrated circuits to align with one another in an immersion fluid. The
aligned circuits may join to form physical and electrical connections.
The resulting structure may be a stack of two integrated circuits
electrically coupled to one another.