A probe card on which micro probe needles are arranged at high density and with high precision without need of a complicated structure or variation in needle height. A probe card 1 installed in a wafer tester includes a board 2 having a wiring pattern for transmitting a test signal to be impressed on a wafer under test, a built-up board 10 formed on the surface of the board 2, a comb-shaped silicon-made probe needle 20 arranged on the built-up board 10 and connected to the surface wiring pattern 11, and a flat portion 12 formed by plating on the surface wiring pattern 11 on the built-up board 10 and having a surface flattened by polishing. The probe needle 20 is loaded on the flat portion 12 and thus mounted on the board 2.