A semiconductor package and method for making a semiconductor package are
disclosed. The semiconductor package has a top surface and a mounting
surface and includes a die, a conducting connecting material, a plating
material and an insulating material. The die has a processed surface
facing towards the mounting surface of the semiconductor package. Exposed
metal connections are at the processed surface of the die. The conducting
connecting material is disposed on the exposed metal connections. The
plating material is in contact with the conducting connecting material.
The insulating material is formed around the conducting connecting
material, and the plating material extends to the exterior of the
insulating material.