A method is to manufacture a surface protective film for transparent conductive films having a rate of thermal shrinkage of no more than 0.9% in both MD (machine direction) and TD (width direction) as measured after being heated at 150.degree. C. for 1 hour. The method includes: providing a base material film; applying an adhesive on one surface of the base material film; and applying a drawing tension of no more than 80 N per width of 1 m of the base material film under conditions of a temperature of 100.degree. C. through 150.degree. C. and a residence time of 20 through 120 seconds, thereby removing a residual stress and simultaneously drying the adhesive.