A structure formed on a semiconductor wafer is examined by obtaining measurements of cross polarization components of diffraction beams, which were obtained from scanning an incident beam over a range of azimuth angles to obtain an azimuthal scan. A zero azimuth position is determined based on the azimuthal scan. The cross polarization components are zero at the zero azimuth position. A measured diffraction signal is obtained using an azimuth angle to be used in optical metrology of the structure. Misalignment of the azimuth angle is detected using the measured diffraction signal and the determined zero azimuth position.

 
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> Method and apparatus for contactless optical measurement of the thickness of a hot glass body by optical dispersion

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