A heat dissipation assembly used for dissipating heat from heat generating
electronic components includes a mounting frame, a heat sink and a fan
duct. The heat sink is positioned on the mounting frame; the fan duct is
attached to the heat sink. The fan duct includes a plurality of first
clamping portions, and the mounting frame includes a plurality of second
clamping portions corresponding to the first clamping portions. The first
clamping portions engage with the second clamping portions to fix the fan
duct and the heat sink onto the mounting frame.