Methods and apparatus for accessing a high speed signal routed on a
conductive trace on an internal layer of a printed circuit board (PCB)
using high density interconnect (HDI technology) are provided. The
conductive trace may be coupled to a microvia (.mu.Via) having a
conductive dome disposed above the outer layer pad of the .mu.Via.
In-circuit test (ICT) fixtures or high speed test probes may interface
with the conductive dome to test the high speed signal with decreased
reflection loss and other parasitic effects when compared to conventional
test points utilizing plated through-hole (PTH) technology.