A package structure realizing a size and/or thickness reduction and suitable for packaging a surface acoustic wave element is provided. The package structure for solving the above challenge includes a base having a thick floor 16b on which to place a surface acoustic wave element 12 and a thin floor 16a on which to place an electronic component 14, the surface acoustic wave element and the electronic component being mounted close to each other on the plane coordinate system. In addition, in the package structure described above, the difference in height between the thin floor 16a and the thick floor 16b is the same as, or larger than, the thickness of the electronic component mounted on the thin floor 16a.