Shoe uppers having smooth seams and methods for producing them are disclosed. In one embodiment the upper uses thermoplastic seam tape which forms bonds between contiguous upper sections after being subjected to heat and/or pressure. In another embodiment, different parts of the shoe can be joined using hidden seams. Close seams can also be covered with a transfer material adapted to give the interior and/or exterior of the upper a smooth surface. In yet another embodiment, a method is disclosed which allows three-dimensional upper sections to be bonded on a last using thermoplastic seam tape.