A heat-resistant, multi-layer label free of both glass frit and silicone resin is described. The label is suitable for use in high temperature applications, e.g., applications in which the label and object to which it is adhered are subjected to a temperature of 700 C. or more. The label before exposure to high temperature comprises: (A) an ink-receptive layer comprising an acrylic-based polymer and first and second planar surfaces (B) a base layer comprising first and second planar surfaces, the first planar surface of the base layer in intimate contact with the second planar surface of the ink-receptive layer, the base layer comprising inorganic powder and an organic binder and (C) a pressure sensitive adhesive (PSA) layer comprising an acrylic-based polymer and first and second planar surfaces, the first planar surface of the PSA layer in intimate contact with the second surface of the base layer.